1. Metallographic method A method of measuring the local thickness of the metal cover layer and the oxide film layer by detecting the cross section with […]

The contents of the quality inspection of the electroplating layer include the appearance, thickness, bonding force with the base metal, ductility, microhardness, brittleness, corrosion resistance, wear […]

The lead frame is a thin metal plate part to be used in semiconductor packages such as IC, LSI, etc. As the chip carrier of the […]

In the early stage of the development of IC lead frame plating, the products are generally all gold-plated, but with the increase in the market demand […]